Assembling electronic devices requires precision and the ability to place key components in tight spaces. Manufacturing systems need the ability to grip a component and then release it in the right spot. To make it even more challenging – the grippers need to be tiny and able to grip and release items that are measured in microns.
Mechanical and aerospace engineering Professor Wanliang Shan started considering the problem in 2016 while he was at the University of Nevada – Reno and was awarded a National Science Foundation (NSF) Materials, Engineering and Processing grant to explore the concept. Continue Reading